2012-08-11

Teardown: Inside the RIM Blackberry Playbook LTE




 RIM Blackberry Playbook LTE

Key Component Listing:
  • Texas Instruments OMAP 4460 – Dual-Core ARM Cortex-A9 Applications Processor
  • Samsung K3PE8E800M – 46nm 8Gbit LPDDR2 DRAM (1 GB DRAM)
  • Wolfson Microelectronics WM8994E – Audio CODEC + Power Amplifiers
  • Texas Instruments TWL6030 – Power Management w/ Switch Mode Charger
  • Samsung KLMBG8FEJA-A001 – Multichip Memory Package - 4 GB MLC NAND Flash
  • Texas Instruments TPS63021 – Buck-Boost Converter
  • Texas Instruments CSD2S401 – MOSFET
  • Intersil ISL951 – Battery Charger
  • Fairchild Semiconductor FDMC7200 – Voltage Regulator
  • Fairchild Semiconductor FDMC510P – P-Channel Power MOSFET
  • Texas Instruments TPS63020 – Buck-Boost Converter
  • ST-Ericsson STV0987 – 5 MP Mobile Image Processor
  • Maxim MAX98302 – Stereo 2.4 W Class D Amplifier
  • Texas Instruments SN74AVCH4T245 – 4-Bit Dual-Supply Bus Transceiver
  • Invensense MPU-3050 – 3-Axis MEMS Gyroscope
  • Freescale Semiconductor MMA8450Q – 3-Axis Accelerometer  
  • Qualcomm PM8028 – Power Management
  • Qualcomm RTR8600 – GSM/CDMA/W-CDMA/LTE Transceiver + GPS
  • Avago ACPM-5004 – LT/W-CDMA Band IV Power Amplifier Module  
  • Hynix H27S1G8F2BFB – 40nm SLC NAND Flash
  • Qualcomm MDM9200 – GSM/W-CDMA/LTE Baseband Processor w/ Memory
  • RF Micro Devices RF8889A – SP10T Antenna Switch Module
  • Texas Instruments WL1283C – WiLink 7.0 single-chip WLAN, GPS, Bluetooth 4.0 and FM solution
  • Triquint TQP6M9002 – WLAN Power Amplifier + Switch

Go for much more details to eetimes.com 

No comments:

Post a Comment